Technological innovation
Study Core Technology and Build Competitive Edge
Ellington Electronics continues to improve the science and technology innovation system, in-depth research and development, and continuously enhance the ability of independent innovation and technological competitiveness.The company has filed 130 patents.58 utility model patents were granted and 19 invention patents were granted.Our in-depth research and development innovation is conducive to further strengthening the company's core competitiveness, consolidating the industryWe have the advantage of leading technology within the company to provide sufficient technical assurance for the implementation of medium and long-term strategic planning and the achievement of short- and medium-term business plan objectives.
New Energy & Power
Automotive Electronics
Industrial Control Medical
PCB technology
Application Areas
Computer & Communications
Multimedia Display
Technological development
Ellington attaches great importance to its own technological development, and carries out a series of R & D investment in three general directions: technology development, model capacity and mass production capacity.
Technological development
Prospective development of PCBs for five major products automotive electronics, new energy and power supply, industrial control medical, computer and communication, multimedia and display;
With automotive products, servers, HDI, high-speed and high-frequency, Rigid-Flex products as the leading products, combined with carrier boards, 5G, base station radar and others, Eaton's product system has been formed to create an industry leader.
Model ability
Various double-sided, high multi-layer, HDI and metal-based PCBs meet the requirements of thick plate, thick copper, thin line, large size and high precision and high reliability;
It has the ability to make deep-controlled mechanical drilling, back drilling, hole filling electroplating, mechanical blind buried holes, buried copper blocks, mixed pressure, resin plug holes, POFV, long and short gold fingers, segmented gold fingers, leadless gold fingers, etc.;
Surface treatment capacity: immersion gold, immersion silver, immersion tin, tin spraying, gold-plated finger, OSP, carbon oil, selective surface treatment, etc.;
Materials: ordinary TG, medium TG, high TG, high frequency and high speed and metal-based materials;
Other PCBs with various special requirements.
Mass production capacity
Mass production of double-sided, high-layer, HDI and metal-based PCBs to meet the requirements of thick plate, thick copper, thin line, large size, high precision and high reliability;
It has the ability to make deep-controlled mechanical drilling, back drilling, hole filling electroplating, mechanical blind buried holes, buried copper blocks, mixed pressure, resin plug holes, POFV, long and short gold fingers, segmented gold fingers, leadless gold fingers, etc.;
Surface treatment capacity: immersion gold, immersion silver, immersion tin, tin spraying, gold-plated finger, OSP, carbon oil, selective surface treatment, etc.;
Materials: ordinary TG, medium TG, high TG, high frequency and high speed and metal-based materials.
Invention project
In 2022, the company will carry out a total of 20 R & D projects, including radar high-frequency PCB research, high-precision line HDI Anylayer production technology research and development, high-speed board insertion loss control technology research, circuit board new back-drilling technology research, backlight Led ultra-high reflectivity white oil circuit board production process research, base station equipment circuit board buried copper block production process research, the above research and development technology has been practical application in domestic and foreign well-known customers in the fields of automotive, communications, consumer electronics end point products, etc., and has been well received by customers.
Technology patent
A total of 102 patents were declared, 28 utility model patents were authorized, and 16 invention patents were authorized.
